Header menu link for other important links
X

Orthodontic Bonding: Review of the Literature

Ali H. Alzainal, Ahmed Shehab Majud, ,
Published in Hindawi
2021
Volume: 2020
   
Pages: 1 - 10
Abstract

Background. Patients seeking orthodontic treatment are increasing, and clinicians often have to place brackets on various surfaces aside from enamel. It is crucial to know what materials or instruments are required to bond brackets to each surface. Objective. This study aims to serve as a clinical guideline for the safest and most effective approaches taken to condition various surfaces for bonding to orthodontic brackets and provide background knowledge on the subject. Materials and Methods. PubMed and EBSCO databases were searched, along with the use of Google Scholar search engine, to obtain relevant articles published in English in peer-reviewed journals, from 1955 to 2020. Keywords used were Shear bond strength; Orthodontic bracket; Base design; Etching; Sandblasting; Laser; Conditioning; Enamel; Ceramic; Porcelain; Gold; Amalgam; Composite. Conclusion. Even though orthophosphoric acid is the most widely used enamel conditioning agent, laser etching should be considered to avoid enamel decalcification. Hydrofluoric acid is the current standard for ceramic conditioning; however, its use intraorally should be minimized due to its toxicity. Orthophosphoric acid, CoJet-Sand air abrasion, and laser etching are viable alternatives for conditioning ceramic. Monobond Etch & Prime is toxic and should not be used intraorally. Composite can be conditioned by bur roughening, and the use of ceramic brackets is recommended. Amalgam and gold surfaces can be conditioned adequately by air abrasion. Despite the claims of many authors, the maximum shear forces that orthodontic brackets are subjected to are not 6–8 mega pascal (MPa). Further investigation is required in that regard. More in vivo studies need to be performed to confirm the in vitro results.

About the journal
JournalData powered by TypesetInternational Journal of Dentistry
PublisherData powered by TypesetHindawi
ISSN16878728
Open AccessNo