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Thermal Resistance Model for Standard CMOS Thermoelectric Generator

  • Helwan University
  • American University in Cairo
  • Zewail City of Science and Technology

Research output: Contribution to journalArticlepeer-review

21 Scopus citations

Abstract

In this paper, an accurate thermal resistance model for a micro-Thermoelectric generator (μTEG) designed using standard complementary metal-oxide-semiconductor (CMOS) technology is presented. The optimal dimensions for the μTEG are determined based on the new μTEG thermal model. The presented models are verified with three-dimensional numerical simulations and compared to published experimental results and the presented models exhibited very good accuracy. An improved output power is obtained when using the new thermal resistance model to determine accurate optimal device dimensions. In this paper, a 1-cm2 cross sectional area μTEG based on a 0.13 μm UMC standard CMOS technology is proposed. An output power of 9.25 μW is produced at 2.34 K of temperature difference between the hot and cold sides of the μTEG. The introduced compact models for thermal resistance and the delivered power model are compatible with SPICE based simulators and hence can be integrated with circuit simulations.

Original languageEnglish
Pages (from-to)8123-8132
Number of pages10
JournalIEEE Access
Volume6
DOIs
StatePublished - 26 Jan 2018
Externally publishedYes

Keywords

  • 0.13 μm CMOS
  • Compact model
  • Efficiency of TEG
  • UMC
  • thermal resistance
  • μTEG

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