Abstract
Silicon-nanocrystal-based multiple-tunnel junction devices with non-linear source-drain current-voltage characteristics and with a source-drain electrode separation ranging from 50 to 200 nm were constructed. A combination of anisotropic wet and dry etching, optical lithography and low-energy Si ion implantation was used for their construction. Electrical characteristics were found to be strongly dependent on the source-drain separation and Si implantation dose.
| Original language | English |
|---|---|
| Pages (from-to) | 1003-1007 |
| Number of pages | 5 |
| Journal | Microelectronic Engineering |
| Volume | 57-58 |
| DOIs | |
| State | Published - Sep 2001 |
| Externally published | Yes |
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