@inproceedings{7b6a7ca6d77a4c92b732a271cba1966c,
title = "Investigation of various envelope complexity linearity under modulated stimulus using a new envelope formulation approach",
abstract = "In [1] a new formulation for quantifying the linearizing baseband voltage signal, injected at the output bias port, to linearize a device behaviour was introduced. A key feature of this approach is that since it is formulated in the envelope domain the number of linearization coefficient required is independent of the envelope shape, complexity. This property is validated by performing baseband linearization investigations on a 10W Cree GaN HEMT device. Modulated signals with increasing complexity 3, 5, and 9-tone modulated stimulus, at 1.5dB of compression, were utilized. In all cases just two-linearization coefficients needed to be determined in order to compute the output baseband signal envelope necessary. Intermodulation distortion was reduced to around -50dBc, a value very close to the dynamic range limit of the measurement system.",
keywords = "Distortion, Envelope, Modulation, Power amplifiers, Waveform engineering",
author = "Ogboi, \{F. L.\} and Tasker, \{P. J.\} and M. Akmal and J. Lees and J. Benedikt and S. Bensmida and K. Morris and M. Beach and J. McGeehan",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 36th IEEE Compound Semiconductor Integrated Circuit Symposium, CSICS 2014 ; Conference date: 19-10-2014 Through 22-10-2014",
year = "2014",
month = dec,
day = "5",
doi = "10.1109/CSICS.2014.6978563",
language = "English",
series = "Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC",
address = "United States",
}