TY - GEN
T1 - Impact of Dielectric Substrate, Feed Connector, and Fabrication Tolerances on the Performance of Planar Millimeter-Wave Antenna Arrays
AU - Jabbar, Abdul
AU - Abbasi, Qammer
AU - Imran, Muhammad Ali
AU - Ur-Rehman, Masood
N1 - Publisher Copyright:
© 2024 18th European Conference on Antennas and Propagation, EuCAP 2024. All Rights Reserved.
PY - 2024
Y1 - 2024
N2 - In this paper, the impact of dielectric substrate, feed connectors, and fabrication tolerances on the performance of planar microstrip mmWave antenna arrays is elucidated. Three similar prototypes of an 8-element wideband series-fed microstrip array, covering the entire 57-71 GHz ISM band, are designed by using three dielectric substrates (RO3003, RO5880, and RO4003C). The influence of the dielectric substrate on -10 dB impedance bandwidth, radiation efficiency, total efficiency, realized gain, sidelobe level, and radiation patterns is thoroughly analyzed through extensive numerical simulations. Moreover, a realistic 3D model of a microstrip edge-fed solderless 1.85mm V-connector is co-simulated with the array design, and its impact on mmWave antenna radiation characteristics is investigated. Furthermore, antenna fabrication tolerances and practical measurement effects at high frequencies are highlighted. These findings offer valuable insights when choosing dielectric substrates and taking into account connector effects while designing mmWave array antennas for a diverse range of futuristic mmWave applications.
AB - In this paper, the impact of dielectric substrate, feed connectors, and fabrication tolerances on the performance of planar microstrip mmWave antenna arrays is elucidated. Three similar prototypes of an 8-element wideband series-fed microstrip array, covering the entire 57-71 GHz ISM band, are designed by using three dielectric substrates (RO3003, RO5880, and RO4003C). The influence of the dielectric substrate on -10 dB impedance bandwidth, radiation efficiency, total efficiency, realized gain, sidelobe level, and radiation patterns is thoroughly analyzed through extensive numerical simulations. Moreover, a realistic 3D model of a microstrip edge-fed solderless 1.85mm V-connector is co-simulated with the array design, and its impact on mmWave antenna radiation characteristics is investigated. Furthermore, antenna fabrication tolerances and practical measurement effects at high frequencies are highlighted. These findings offer valuable insights when choosing dielectric substrates and taking into account connector effects while designing mmWave array antennas for a diverse range of futuristic mmWave applications.
KW - 60 GHz antenna array
KW - dielectric substrate
KW - fabrication tolerance
KW - mmWave connector
UR - https://www.scopus.com/pages/publications/85192457253
U2 - 10.23919/EuCAP60739.2024.10501171
DO - 10.23919/EuCAP60739.2024.10501171
M3 - Conference contribution
AN - SCOPUS:85192457253
T3 - 18th European Conference on Antennas and Propagation, EuCAP 2024
BT - 18th European Conference on Antennas and Propagation, EuCAP 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th European Conference on Antennas and Propagation, EuCAP 2024
Y2 - 17 March 2024 through 22 March 2024
ER -