Abstract
A new process for the fabrication of silicon wires on SOI material using anisotropic dry and wet etching is proposed. Arrays of silicon pads joined by narrow Si wires have been successfully fabricated. The structures are uniform and precisely controlled, thus demonstrating the reliability of the process and its suitability for nanodevice applications.
| Original language | English |
|---|---|
| Pages (from-to) | 551-554 |
| Number of pages | 4 |
| Journal | Microelectronic Engineering |
| Volume | 41-42 |
| DOIs | |
| State | Published - 1998 |
| Externally published | Yes |
Fingerprint
Dive into the research topics of 'Fabrication of Si nano-wires using anisotropic dry and wet etching'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver