TY - GEN
T1 - Digital Twins and AI
T2 - International Conference on Innovative Practices in Technology and Management, ICIPTM 2026
AU - Gupta, Ashulekha
AU - Al Said, Nidal
AU - Al-Jawahry, Hassan M.
AU - Srivastava, Mayank
AU - Donthamsetty, Suneel
AU - Kaushik, Abhishek
N1 - Publisher Copyright:
© 2026 IEEE.
PY - 2026
Y1 - 2026
N2 - Digital Twin technology and Artificial Intelligence (AI) have been integrated as the new paradigm of the next generation of smart manufacturing systems. The Digital Twins enable creation of high-fidelichen virtual models of the physical resources, processes and manufacturing environments where it can be possible to monitor, simulate and optimize the manufacturing life cycle. With AI-based analytics, machine learning, and predictive intelligence, Digital Twins can be formulated into real-time adaptive and autonomous decision support systems. The integration can be very powerful to enhance the operational effectiveness, the accuracy of predictive maintenance, quality assurance and optimization of resources and facilitate data-oriented strategic planning. Increased scalability of AI-enables Digital Twins of manufacturing ecosystem is further enhanced by the growth of Industrial Internet of Things (IIoT), cloud-edge computing systems, and cyber-physical systems. However, there are interoperability of data, model synchronization, cybersecurity, computational complexity, and organizational preparedness problems which continue to hamper widespread use. Conceptual, enabling technologies, architectural and strategic implications of Digital Twin integration with AI in smart manufacturing will be an indepth part of the paper. Besides that, it examines the current industrial uses, major research shortfalls and future orientations needed to have resilient, autonomous and sustainable manufacturing businesses aligning with the Industry 4.0 and Industry 5.0 visions.
AB - Digital Twin technology and Artificial Intelligence (AI) have been integrated as the new paradigm of the next generation of smart manufacturing systems. The Digital Twins enable creation of high-fidelichen virtual models of the physical resources, processes and manufacturing environments where it can be possible to monitor, simulate and optimize the manufacturing life cycle. With AI-based analytics, machine learning, and predictive intelligence, Digital Twins can be formulated into real-time adaptive and autonomous decision support systems. The integration can be very powerful to enhance the operational effectiveness, the accuracy of predictive maintenance, quality assurance and optimization of resources and facilitate data-oriented strategic planning. Increased scalability of AI-enables Digital Twins of manufacturing ecosystem is further enhanced by the growth of Industrial Internet of Things (IIoT), cloud-edge computing systems, and cyber-physical systems. However, there are interoperability of data, model synchronization, cybersecurity, computational complexity, and organizational preparedness problems which continue to hamper widespread use. Conceptual, enabling technologies, architectural and strategic implications of Digital Twin integration with AI in smart manufacturing will be an indepth part of the paper. Besides that, it examines the current industrial uses, major research shortfalls and future orientations needed to have resilient, autonomous and sustainable manufacturing businesses aligning with the Industry 4.0 and Industry 5.0 visions.
KW - Artificial Intelligence
KW - Digital Twin Technology
KW - Industry 4.0
KW - Predictive Analytics
KW - Smart Manufacturing
UR - https://www.scopus.com/pages/publications/105037849578
U2 - 10.1109/ICIPTM69057.2026.11465619
DO - 10.1109/ICIPTM69057.2026.11465619
M3 - Conference contribution
AN - SCOPUS:105037849578
T3 - International Conference on Innovative Practices in Technology and Management, ICIPTM 2026
BT - International Conference on Innovative Practices in Technology and Management, ICIPTM 2026
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 19 February 2026 through 21 February 2026
ER -