@inproceedings{a5039bf08b7a44caab1c9929d7f080dc,
title = "A comparative evaluation of single-walled carbon nanotubes and copper in interconnects and Through-Silicon Vias",
abstract = "In this paper we compare Single-walled Carbon nanotubes (SWCNT) and copper as fillers for Through-Silicon Vias (TSVs) in 3D chips and as materials for on chip interconnects. It is shown that vias and interconnects made from SWCNTs handle crosstalk better than those made from copper. The choice of SWCNT is based on their higher resilience to electromigration due to the strong sp2 bonding between the carbon atoms, which enables SWCNT wires to carry more current than a copper wire of the same dimensions.",
keywords = "Carbon Nanotube (CNT), Crosstalk, Interconnect, Through-Silicon Via (TSV)",
author = "Bassem Safieldeen and Hassan Mostafa and Hamdy Abdelhamid and Yehea Ismail",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2015 ; Conference date: 06-12-2015 Through 09-12-2015",
year = "2016",
month = mar,
day = "23",
doi = "10.1109/ICECS.2015.7440368",
language = "English",
series = "Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "519--522",
booktitle = "2015 IEEE International Conference on Electronics, Circuits, and Systems, ICECS 2015",
address = "United States",
}